Evaluation and Analysis of Substrate Noise in a Microprocessor

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Other Title
  • マイクロプロセッサにおける基板ノイズの評価と解析(アナログ,アナデジ混載,RF及びセンサインタフェース回路)
  • マイクロプロセッサにおける基板ノイズの評価と解析
  • マイクロプロセッサ ニ オケル キバン ノイズ ノ ヒョウカ ト カイセキ

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Abstract

An integrated power and substrate noise analysis environment targeting systems-on-chip (SoC) design was verified through comparison with on-chip noise measurements of a microprocessor chip in a 90-nm CMOS technology. The test chip includes 12 pairs of power and ground noise monitors within a processor and also embedds substrate noise evaluation areas with 120 probing points, realizing power and substrate noise measurements in terms of time-domain dynamic waveforms and spacial distribution. In addition to noise generation in digital circuits, noise propagation through on-chip silicon substrate and of chip package and board impedances needs to be carefully considered for quantitative and quality power noise simulation.

Journal

  • ITE Technical Report

    ITE Technical Report 33.39 (0), 11-14, 2009

    The Institute of Image Information and Television Engineers

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