Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel Signal Processors

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  • 画素並列信号処理3次元構造CMOSイメージセンサ(固体撮像技術および一般)
  • 画素並列信号処理3次元構造CMOSイメージセンサ
  • ガソ ヘイレツ シンゴウ ショリ 3ジゲン コウゾウ CMOS イメージセンサ

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Description

We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D converters (ADCs), thereby meeting the demand for high resolution and high frame rate imaging. Photodiode (PD) and inverter layers were directly bonded with the damascened Au electrodes to provide each pixel with in-pixel A/D conversion. We designed ADC with a pulse frequency output and fabricated a prototype sensor with 64 pixels. The developed sensor successfully captured video images and confirmed excellent linearity with a wide dynamic range of more than 80 dB, which showed feasibility of pixel-level 3D integration for high-performance CMOS image sensors.

Journal

  • ITE Technical Report

    ITE Technical Report 39.16 (0), 5-8, 2015

    The Institute of Image Information and Television Engineers

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