Development of Package-level DC Power Grid Technology Toward Low Power Electronic Equipments

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  • 電子機器の省電力化を目指したパッケージレベルDCパワーグリッドの研究開発
  • デンシ キキ ノ ショウ デンリョクカ オ メザシタ パッケージレベル DC パワーグリッド ノ ケンキュウ カイハツ

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Abstract

Since East Japan earthquake in 2011, there is currently strong need not only for renewable energy development but also for efficient systems with more and more energy/power saving. The purpose of this study is to realize a novel power delivery to various devices in the System in Package having plural LSIs (analogue/digital), sensors, antennas and others, which will be composed of many DC-DC converters integrated in package, the authors call it "Package-level DC power grid" or "Micro smart power grid controlled through ICT scheme". This paper describes the current status of the Package-level DC power grid for System in Package.

Journal

  • ITE Technical Report

    ITE Technical Report 37.35 (0), 17-21, 2013

    The Institute of Image Information and Television Engineers

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