Electrodeposition of Tin-Zinc Eutectics Alloy and Codeposition Mechanism of Zinc for Low Temperature Lead-Free Soldering.

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  • 低温鉛フリーはんだ接合を目的としたスズ‐亜鉛共晶合金の電析および亜鉛の共析機構
  • テイオン ナマリ フリー ハンダ セツゴウ オ モクテキ ト シタ スズ アエン キョウショウ ゴウキン ノ デンセキ オヨビ アエン ノ キョウセキ キコウ

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Electrodeposited tin-zinc eutectic alloy is a promising candidate to replace tin-lead solder coatings and provide low temperature soldering. The eutectic alloy film (Sn-9.0Zn, mass%) of the desired constituent was deposited at cathode current density 0.5-3A/dm2 in a sulfosuccinate bath using the additive polyoxyethylene-α-naphthol (POEN) . The presence of POEN increased tin deposition polarization, markedly inhibited preferential deposition of tin over a noble potential range, and an appreciable amount of zinc was codeposition. The bath is stable systems, precipitate consisting of metastannic acid were not observed after standing for six months. The eutectic alloy film consists of β-tin and zinc phases, and its solidus temperature was 198°C. Whisker were not observed on the eutectic alloy film on the copper substrate after one year of aging at room temperature.

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