Study of New Removal Technique by Use of Magnetic Polishing Method for Copper Overhang Generated in the Direct Laser Via Process
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- Katayama Masahiko
- Department of Advanced Interdisciplinary Sciences, Graduate School of Engineering, Utsunomiya University
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- Yoshihara Sachio
- Department of Advanced Interdisciplinary Sciences, Graduate School of Engineering, Utsunomiya University
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- Seino Shozo
- Research & Development Center, JCU Corporation
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- Kimizuka Ryoichi
- Research & Development Center, JCU Corporation
Bibliographic Information
- Other Title
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- ダイレクトレーザービア工程において発生する銅オーバーハングの磁気研磨法による新規除去技術の検討
- ダイレクトレーザービア コウテイ ニ オイテ ハッセイ スル ドウ オーバーハング ノ ジキ ケンマホウ ニ ヨル シンキ ジョキョ ギジュツ ノ ケントウ
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Abstract
In recent years, via holes have been used to connect the external wiring and internal wiring of multilayer substrates. When copper foil in the wiring layer is processed by a laser, melted copper is adhered, and projections called “overhangs” are formed around the opening of the via holes. The adhesiveness and flatness of the plating are decreased by the overhangs, and it is therefore indispensable to remove them. In this study, a magnetic polishing method was tried as a novel removal technique. This paper describes the polishing results and the method for producing the magnetic abrasive grains used in the polishing.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 17 (4), 292-296, 2014
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679536541440
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- NII Article ID
- 130004699631
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- NII Book ID
- AA11231565
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- COI
- 1:CAS:528:DC%2BC2cXhslelu7rM
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 025640977
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed