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High Speed Data Transfer Technology Using COC-Multichip LSI (MCL)
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- EZAKI Takayuki
- System in Package Development Dept., Semiconductor Technology Development Group, Semiconductor Solutions Network Company, SONY Corporation
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- OZAKI Hiroshi
- System in Package Development Dept., Semiconductor Technology Development Group, Semiconductor Solutions Network Company, SONY Corporation
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- ISHIKAWA Natsuya
- System in Package Development Dept., Semiconductor Technology Development Group, Semiconductor Solutions Network Company, SONY Corporation
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- SASAKI Naoto
- Advanced Technology Dept., Microsystems Development Div., Sony Semiconductor Kyushu Corporation
Bibliographic Information
- Other Title
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- SiP技術の将来像―そのニーズと応用 COC技術を採用した高速データ転送技術―Multichip LSI(MCL)
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Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 8 (7), 550-554, 2005
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679536787712
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- NII Article ID
- 130004166220
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- ISSN
- 1884121X
- 13439677
- https://id.crossref.org/issn/13439677
- http://id.crossref.org/issn/13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles