Influence of Substrate Structure on Reliability of Bare Die Embedding Substrate
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- Miyama Katsumi
- Hokkaido Institute of Technology
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- Takahashi Hisafumi
- ISS Hokkaido Inc.
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- Iwata Tomoyuki
- Information Services International-Dentsu, Ltd.
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- Tanaka Hiroyuki
- Hokkaido Research Organization
Bibliographic Information
- Other Title
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- ベアチップ内蔵プリント配線板の信頼性に及ぼす配線板構造の影響
- ベアチップ ナイゾウ プリント ハイセンバン ノ シンライセイ ニ オヨボス ハイセンバン コウゾウ ノ エイキョウ
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Abstract
Embedding active device technology is a very effective means of downsizing printed wiring boards, because of its large occupied area. Since a bare die is preferred in order to achieve a thin substrate, the flip chip mounting technique is inevitably used. In this case, resin is used to under-fill the gap between the bare die and the inner layer of substrate. In our evaluation using TEG chips, delamination at this part was found depending on the substrate structure, conductive pattern, and bare die size. Regarding these phenomena, thermal deformation analyses and actual deformation measurements were performed, and these results suggested the possibility of failure prediction even by elastic analysis. In addition, we found that thermal deformation could be reduced by adjusting the copper conductive pattern.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 15 (7), 550-557, 2012
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282679537300992
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- NII Article ID
- 10031080344
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- NII Book ID
- AA11231565
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- COI
- 1:CAS:528:DC%2BC3sXitVWnu70%3D
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 024081391
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed