Simultaneous Printing of Conductive Pattern with Different Line Width Using Soft Blanket Gravure Printing Method
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- Nakamura Hiroyuki
- Research Center for Organic Electronics, Yamagata University
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- Yoshida Yasunori
- Research Center for Organic Electronics, Yamagata University
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- Izumi Konami
- Research Center for Organic Electronics, Yamagata University
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- Kumaki Daisuke
- Research Center for Organic Electronics, Yamagata University
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- Tokito Shizuo
- Research Center for Organic Electronics, Yamagata University
Bibliographic Information
- Other Title
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- ソフトブランケットグラビア印刷技術を用いた線幅が異なる配線の同時印刷
- ソフトブランケットグラビア インサツ ギジュツ オ モチイタ センハバ ガ コトナル ハイセン ノ ドウジ インサツ
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Abstract
We have developed a new printing technology called “Soft Blanket Gravure (SBG)” printing, which is able to print patterns onto curved or three-dimensional object surfaces using a thick and soft offset blanket (called a “soft blanket”). We have found that SBG printing can print silver inks under various conditions where conventional gravure offset printing cannot typically print. In particular, SBG printing can print wide interconnects with widths of several millimeters. We have also succeeded in simultaneously printing interconnects that have widths of 50-1,000 micrometers on a glass substrate.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 21 (2), 137-142, 2018
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282679537801216
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- NII Article ID
- 130006407236
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 028889122
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed