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Development of Printed Wiring Board Technologies for the K Computer
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- Nakamura Naoki
- Fujitsu Advanced Technologies Limited
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- Fukuda Takashi
- Fujitsu Advanced Technologies Limited
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- Matsui Akiko
- Fujitsu Advanced Technologies Limited
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- Yamada Tetsurou
- Fujitsu Advanced Technologies Limited
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- Yamauchi Jin
- Fujitsu Interconnect Technologies Limited
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- Kashiwa Takefumi
- Fujitsu Interconnect Technologies Limited
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- Kirinaka Masaki
- Fujitsu Interconnect Technologies Limited
Bibliographic Information
- Other Title
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- スーパーコンピュータ「京」に適用した高性能システムボード用配線板技術の開発
- ヘイセイ 24ネン ギジュツショウ ジュショウ コウエン スーパーコンピュータ 「 キョウ 」 ニ テキヨウ シタ コウセイノウ システム ボードヨウ ハイセンバン ギジュツ ノ カイハツ
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Description
The K computer ranked first on the TOP500 List of June 2011. The achievement of such high performance is due not only to the high-performance CPUs but also largely to the system packaging technologies: rack technology to allow high-density mounting of the CPUs, connection technology to achieve high-speed data transmission between the CPUs, and cooling technology for improved reliability. This paper describes the printed wiring board technologies applied to the K computer.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 15 (6), 453-460, 2012
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679538412288
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- NII Article ID
- 10030878319
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 023974926
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed