チタン箔溶断セラミックス接合における回路インダクタンスの効果

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タイトル別名
  • Effect of Circuit Inductance on Ceramics Joining by Titanium Foil Explosion
  • チタン ハク ヨウダンセラミックス セツゴウ ニ オケル カイロ インダクタンス ノ コウカ

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This article describes the influences of circuit inductance on alumina (Al2O3) tile joining using explosive titanium foil. Several kAs pulse current was supplied from 8.28 µF storage capacitor to the 50 µm thickness titanium foil which was sandwiched between the Al2O3 tiles with pressure of 8.3 MPa. The temperature of the foil was rapidly increased owing to ohmic heating with the large current, and then the foil was liquefied and vaporized. The Al2O3 tiles were successfully bonded when the input energy to the titanium foil was higher than the energy required for the foil vaporization. The bonding strength increases with increasing the energy input to the foil. However, the foil explosion cracked the tiles when the input energy exceeds a critical value. Increasing the circuit inductance from 1.13 µH to 64.8 µH, the critical energy of tile cracking increase from 160 J to 507 J, respectively. the maximum bonding strength of 330 kg was obtained when the circuit inductance was 21.8 µH. An investigation of the interfacial structure of the joints using electron probe micro-analysis revealed that distinct reaction areas existed in the interlayer.

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