Implementation of Communication Board with MAP Lower Layers and its Performance Measurement

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  • MAP下位層通信ボードの試作とその性能評価
  • MAP カイソウ ツウシン ボード ノ シサク ト ソノ セイノウ ヒョウカ

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Abstract

The Manufacturing Automation Protocol (MAP) is the communication protocol for factory LAN systems. MAP complies with the definition of the Open Systems Interconnection (OSI) Reference model. At present, the intoroduction of many kinds of controller and device with MAP functions are intended to realize the Computer Integrated Manufacturing (CIM).<br>This paper describes the implementation of communication board based on the MAP 3.0 specification. This communication board has the communication functions with the OSI lower layer protocols, the Transport protocol through the MAC protocol. This paper also presents the performance model to estimate the performance of this communication board and the comparison with the performance measurement.

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