Deterioration of Insulation in Printed Circuit Boards due to Ionic Migration

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  • プリント基板のイオンマイグレーション解析
  • プリント キバン ノ イオンマイグレーション カイセキ

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Abstract

Miniaturization of automotive electronic components is required in order to improve the comfort of the vehicle. For this, reduced size and increased density of the printed circuit board becomes indispensable, but issues then arise with insulation degradation due to ionic migration. In this paper we describe the results of our observations of ionic migration due to differences in materials in the circuit board and resistor and the electric field pattern.

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