Investigation of Crack Suppression Mechanism of Thin Ply CFRP Cross-ply Laminate by Cohesive Element Method

DOI 10 References
  • TAKEUCHI Hiroki
    SAKAI OVEX CO., LTD
  • SAITO Hiroshi
    Research Laboratory for Integrated Technological Systems, Kanazawa Institute of Technology
  • KIMPARA Isao
    Research Laboratory for Integrated Technological Systems, Kanazawa Institute of Technology

Bibliographic Information

Other Title
  • 結合力要素法による薄層CFRP直交積層板のき裂進展抑制メカニズムの検討

Abstract

In this study, the crack suppression mechanism in the thin-ply laminate was discussed by the mesoscopic finite element analysis. The intraply crack extension in the thin ply 90° layer, which has the thickness from 40 to 150 μm, was simulated with the cohesive element. In addition, the effect of initial defect on the crack extension behavior was also discussed. The crack extension behavior showed good agreement with the experimental results in any ply thickness for 6 J/m2 was applied to the cohesive energy. The crack initiation strain was not influenced by the existence of the initial defect up to 10 μm length. However the crack initiation strain was not influenced by the ply thickness, the crack penetration strain tended to increase with decrease of ply thickness.

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Details 詳細情報について

  • CRID
    1390282679600575360
  • NII Article ID
    130003305444
  • DOI
    10.6089/jscm.38.30
  • COI
    1:CAS:528:DC%2BC38XlslaqsbY%3D
  • ISSN
    18848559
    03852563
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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