Electroless Solder Plating.

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  • 無電解はんだめっき

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Electroless solder plating on copper substrate is investigated. Since tin and lead do not have autocatalytic nature, deposition reaction can only be occured by displacement or disproportionation reaction. In this report, possibility of displacement reaction is applied to the tin and lead alloy deposition. It was found that the potential of copper can be shifted to less noble direction than lead and tin by adding 30-12 g /l of thiourea. Tin borofluoride and lead borofluoride were selected as a metal sources since these salts are easy to make up the bath and performed stable bath. Also free borofluoride ions are important ingredients to increase plating rate and give the optimum compositions of solder deposition. Free borofluoride ions are very effective to maintain bath stability and deposition rate is increasing up to 12gm/ hr by adding 0.1 mol / lof free borofluoride acid.

Journal

  • Circuit Technology

    Circuit Technology 6 (6), 299-305, 1991

    The Japan Institute of Electronics Packaging

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