ファインピッチ対応リフローソルダリング

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  • 西 壽雄
    九州松下電器株式会社生産技術研究所

書誌事項

タイトル別名
  • Reflow Soldering for Fine Lead Pitch Packages.

説明

Demands for higher function and smaller size of electronic products require higher-density mounting technology. For this issue, We have developed the new mounting process for 0.3mm lead pitch QFP. Three key technologies for this process are 1) Pre-coated solder, 2) Lead-cut & forming just befor mounting, 3) High accuracy mounting with Laser-recognition. We carried out the experimen-tal product using S-FPAC 144 pins of Japan TI and we got the connection rate of 99.6% for 300 packages and 99.99% for total leads. Also we could get good fillet shape of solder and enough connecting strength.

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