Reflow Soldering for Fine Lead Pitch Packages.

DOI Web Site
  • NISHI Toshio
    Production Engineering Research Laboratory, Kyushu Matsushita Electric Co., Ltd.

Bibliographic Information

Other Title
  • ファインピッチ対応リフローソルダリング

Description

Demands for higher function and smaller size of electronic products require higher-density mounting technology. For this issue, We have developed the new mounting process for 0.3mm lead pitch QFP. Three key technologies for this process are 1) Pre-coated solder, 2) Lead-cut & forming just befor mounting, 3) High accuracy mounting with Laser-recognition. We carried out the experimen-tal product using S-FPAC 144 pins of Japan TI and we got the connection rate of 99.6% for 300 packages and 99.99% for total leads. Also we could get good fillet shape of solder and enough connecting strength.

Journal

  • Circuit Technology

    Circuit Technology 8 (3), 209-216, 1993

    The Japan Institute of Electronics Packaging

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