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- ARAI Takeshi
- Designed Products Laboratory, Asahi Chemical Industry Co., Ltd.
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- YOKOYAMA Hidehisa
- Designed Products Laboratory, Asahi Chemical Industry Co., Ltd.
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- KINOSHITA Shozo
- Designed Products Laboratory, Asahi Chemical Industry Co., Ltd.
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- KATAYOSE Teruo
- Designed Products Laboratory, Asahi Chemical Industry Co., Ltd.
Bibliographic Information
- Other Title
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- 熱硬化型PPE樹脂積層板の高周波領域の誘電特性の安定性
Description
Thermosetting PPE resin S4100 was developed as an insulating material for printed circuit boards, which has both high glass transition temperature and excellent dielectric characteristics. S4100 laminate produced by using E-glass cloth was evaluated and found to have both superior dielectric properties, such as ε=3.36, tanδ=0.004 at 2GHz, and high Tg of 200°C which is comparable to polyimide laminate. The dependence of dielectric constant and dissipation factor on temperature, and their stability under humidified condition were evaluated and the results were compared with FR-4 and polytetrafluoroethylene (PTFE) laminate based on the idea that stability of dielectric characteristics at GHz region is an important measure of insulation reliability of insulating materials. Dielectric characteristics of S4100 laminate were found to be more stable than PTFE laminate having lower dielectric constant and dissipation factor, under temperature change ranging from -20°C to 80°C because of high glass transition temperature of S4100 laminate. Furthermore, S4100 laminate showed smaller change in dielectric constant snd dissipation factor under the condition of humidified in pressure vessel because S4100 had low water absorption of 0.2% by weight. Moreover, S4100 laminate had no blistering in solder bath after the test. On the other hand, FR-4 showed high water absorption of 0.9% by weight and blistering in solder bath under the above conditions. The measurement of transmission loss of laminate certified the fact that S4100 laminate has very low transmission loss, which is nearly equal to that of PTFE laminates in the frequency range of 0.8-4GHz. It is confirmed that S4100 is a useful material for the application to PWB's of high speed digital circuits and high frequency communication equipment.
Journal
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- The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10 (2), 113-117, 1995
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679644216448
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- NII Article ID
- 130004062643
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- ISSN
- 18841201
- 13410571
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed