Interface Migration and Diffusion Behavior on Bonding Interface of Dissimilar Materials.
-
- KOMIZO Yu-ichi
- Sumitomo Metal Industries, Ltd. Corporate Research & Development Laboratories
-
- OGAWA Kazuhiro
- Sumitomo Metal Industries, Ltd. Corporate Research & Development Laboratories
書誌事項
- タイトル別名
-
- Interface Migration and Diffusion Behav
この論文をさがす
抄録
The evaluation of an interface migration for the diffusion bonding process in which the temperature continuously changed was examined based on the kinetics and the Ni diffusion at the bonding interface of dissimilar materials of both carbon-steel/ Ni and ferritic stainless steel/austenitic stainless steel. On the bonding interface of SUS444/316L the γ phase was transformed into the a phase by Ni diffusion from the γ phase to the α phase side. The distance of interface migration was obtained analytically from the balance of Ni atoms that enter and exit at the interface. An interface migration in the case of multistep and continuous cooling was confirmed to be predicted from the calculation of an interface migration in the state of constant temperature.
収録刊行物
-
- 溶接学会論文集
-
溶接学会論文集 15 (3), 425-431, 1997
一般社団法人 溶接学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390282679699121920
-
- NII論文ID
- 110003421810
-
- NII書誌ID
- AN1005067X
-
- ISSN
- 24348252
- 02884771
-
- NDL書誌ID
- 4324557
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可