Joining of A1050/A5052 and A1050/Cu by Ultrasonic Bonding and their Materials Evaluation
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- Hamed ABDEL-ALEEM
- Kyushu Institute of Technology
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- YAMAGATA Toshio
- Kyou Sera Corporation
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- KATOH Mitsuaki
- Kyushu Institute of Technology
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- NISHIO Kazumasa
- Kyushu Institute of Technology
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- YAMAGUCHI Tomiko
- Kyushu Institute of Technology
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Description
We tried to bond A1050/A5052 and A1050/Cu by ultrasonic spot bonding and evaluated the bondability of joints by performing tensile shear test, the observation of microstructures and ultrasonic testing. In principle a good joint was obtained by ultrasonic bonding when we selected good bonding conditions and no intermetallic compound was observed at bond interface. It was observed that a crack initiated just before the maximum load near the boundary of the bond area of A1050 in both cases of A1050/A5052 and A1050/Cu by radiographic testing during shear test. Then bond area started to deform and changed its shape from circle to ellipse and the crack propagated further. The maximum load in shear test was obtained at the appropriate input energy depending on the cases of A1050/A5052 and A1050/Cu. The situation of bonds could be evaluated by ultrasonic testing. We could observe nano-crystals near the bond interface of A1050/Cu with TEM probably due to the rapid deformation during the bonding.<br>
Journal
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- QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
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QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 21 (4), 493-500, 2003
JAPAN WELDING SOCIETY
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Details 詳細情報について
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- CRID
- 1390282679702544128
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- NII Article ID
- 130004445356
- 110003422375
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- NII Book ID
- AN1005067X
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- COI
- 1:CAS:528:DC%2BD2cXhsVansQ%3D%3D
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- ISSN
- 24348252
- 02884771
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- NDL BIB ID
- 6772024
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed