Sensing for Machining Using Pressure Level of Sound Radiated by Paperboard Die Cutting.

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  • 音圧レベルを用いた板紙型抜き加工センシング
  • オンアツ レベル オ モチイタ イタガミ カタヌキ カコウ センシング

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Abstract

This paper describes the possibility of sensing for machining, using the sound that occurs under paperboard die cutting, which is commonly used for making various paper packages. Among the actual production lines, it is important to estimate the wear of die tools. And any kind of automatic technique for detecting cutting condition is required for increasing productivity and reducing operator's task. In this study, the sound radiated in the cutting process was measured by varying several machining conditions on the test machine, and analyzed. The following results were obtained: The sound seems to be caused by impulsive strike between a blade tip and a counter plate; The repeatability of sound waveform is very good in the same machining condition; Obvious feature is not revealed in the sound spectrum for distinguishing each condition; On the other hand, a sound pressure level (SPL) denotes obvious difference among each condition; The radiated sound energy is almost in proportion to the elastic energy stored in the machine just before completion of cutting. Hence, the SPL would become a good index to denote the wear of blade tip, the occurrence of harmful thread dross, etc.

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