UVレーザによる高アスペクト比小径穴あけ加工 (第3報)

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タイトル別名
  • High-aspect-ratio Microdrilling with UV Laser Ablation III.
  • UV レーザ ニ ヨル コウアスペクトヒ ショウケイ アナアケ カコウ ダイ3ポウ パルスハバ ノ エイキョウ
  • —Influence of Pulse Width on Hole Profile—
  • —パルス幅の影響—

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抄録

High-aspect-ratio microdrilling of borosilicate glass has been demonstrated by the forth harmonic of nanosecond Nd:YVO4 laser. In this paper, we investigated about the influence of the pulse width on the hole profile. The pulse width was expanded by splitting the laser beam and mixing after passing through optical passes with different length. Firstly, the holes drilled with various polarized beam. As a result, depths of the holes drilled with different polarization of the beam were same. Then depths of the drilled holes with different pulse width were measured. Deeper holes were obtained with faster pulses when the deep holes were drilled. However, no clear difference was observed when the drilled holes were shallow. The profiles of the holes drilled with different pulse width were measured. As a result, the profiles were almost same around the entrance. On the other hand, the diameters of the holes drilled with slower pulses were a few μm smaller than that with faster pulses around the bottom. It was shown that pulse width influenced more when deep holes were drilled.

収録刊行物

  • 精密工学会誌

    精密工学会誌 76 (12), 1383-1387, 2010

    公益社団法人 精密工学会

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