Viscoelastic Properties of The Phenolic Molding Compound

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  • フェノール樹脂成形材料の粘弾性的性質

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The curing behavior of phenolic molding compounds was studied under the heating and pressing conditions with the JSR-curelastometer and the phase angle indicator. <BR>In addition, the viscoelastic behavior of the materials was tried to analyze during the curing process by assuming two elements Maxwell-model as the viscoelastic model, and by considering heat transfer through the material from the die. As the results, complex elastic modulus G of the material could be calculated with the following equation (Wo' is the force detected actually with the load-cell), G= (9.09X 104) Wo' and the viscoelastic properties of the material during the molding process could be approximated, with practically sufficient precision, by the simple two elements model. (Fig.11) <BR>And the change of element-parameters (elastic coefficient G, viscosity coefficient n) with time were individually estimated with the following equations.<BR>(t is the molding-time) <BR>G=Gm [1-exp {-kG (t-tGO)}] <BR>n=nm [1-exp {-kn (t-tno)}] <BR>As a rule, kn was greater than kG and the temperature dependence of them was represented witth the following equation. (Fig. 7, Fig. 9, and Fig.10) <BR>k=k*exp (-Ec/RoT) <BR>Tin the above equation is the average material temperature and could be calculated with the following equation. (a is the mean thermal diffusivity) <BR>T≅Tw-0.811 (Tw-To) exp [- (2.47 X106) αt

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Details 詳細情報について

  • CRID
    1390282680066877312
  • NII Article ID
    130006886246
  • DOI
    10.11364/networkpolymer1980.1.208
  • ISSN
    21865361
    03884384
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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