Inspecting Printed Wiring by Using the Eddy-Current Testing Approach

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  • Fujiki H.
    Laboratory of Magnetic Field Control and Applications, Faculty of Engineering, Kanazawa University
  • Yamada S.
    Laboratory of Magnetic Field Control and Applications, Faculty of Engineering, Kanazawa University
  • Iwahara M.
    Laboratory of Magnetic Field Control and Applications, Faculty of Engineering, Kanazawa University

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Other Title
  • 渦電流探傷手法によるプリント基板配線検査の基礎検討
  • ウズ デンリュウ タンショウ シュホウ ニヨル プリント キバン ハイセン ケ
  • 渦電流探傷手法によるプリント基板配線検査の基礎検討 (<特集>計測・磁気応用)

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Abstract

Eddy-current testing (ECT) is used for inspecting cracks in metal structures. We propose a planar-type ECT probe consisting of a meander and a mesh coil, and discuss the possibility of using ways of this probe to inspect disconnections in printed wirings. This paper describes (1) finding disconnections in printed wiring and (2) discriminating between various patterns of printed wiring and disconnections. Experimental results confirm that it is possible in principle to use ECT for inspecting printed wiring.

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