Temperature Dependence of the Yield Stress of Ni<SUB>3</SUB>Fe Single Crystals

DOI HANDLE Web Site 被引用文献2件 参考文献71件 オープンアクセス
  • Wee Dang-Moon
    Graduate School, Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Suzuki Tomoo
    Research Laboratory of Percision Machinery and Electronics, Tokyo Institute of Technology

書誌事項

公開日
1981
DOI
  • 10.2320/matertrans1960.22.163
公開者
社団法人 日本金属学会

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説明

Compression tests have been made on well characterized Ni3Fe single crystals over the temperature range 77 to 830 K in order to obtain systematic yield stress data comparable with well established data on Cu3Au single crystals. Below room temperature the fully ordered Ni3Fe has a lower yield stress than the disordered Ni3Fe, as has been generally observed in various ordered alloys. It is demonstrated that strength peaks in ordered Ni3Fe appear both at an intermediate temperature below Tc and just below Tc. The strengthening mechanism in the former is compatible with the Brown mechanism, and that in the latter is due to disordering as is the case with Cu3Au. In contrast, the increase in flow stress with increasing temperature of ordered Cu3Au at lower temperatures reported in literature is attributable to the thermally activated cross slip from {111} to {100} planes. Based on the phase stability concept, the differences in strength behavior between Ni3Fe and Cu3Au can be interpreted in terms of the differeces in APB morphology, i.e., the anisotropy of APB energy.

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