Grindability of Silicon Nitride Ceramics with Metal-Bonded Grinding Wheel
-
- NISHIOKA Takao
- Itami Research Laboratories, Sumitomo Electric Industries, Ltd.
-
- NAKAO Hiroshi
- Osaka Diamond Industries, Ltd.
-
- YAMAKAWA Akira
- Itami Research Laboratories, Sumitomo Electric Industries, Ltd.
-
- MIYAKE Masaya
- Itami Research Laboratories, Sumitomo Electric Industries, Ltd.
-
- TANAKA Yoshio
- Department of Mechanical Systems Engineering, Osaka Prefecture University
Bibliographic Information
- Other Title
-
- メタルボンド砥石によるSi<sub>3</sub>N<sub>4</sub>セラミックスの研削加工特性
- メタル ボンド トイシ ニヨル Si3N4 セラミックス ノ ケンサク カコウ
Search this article
Abstract
The effect of distribution of grain cutting edge on the surface of the wheel on the grindability of silicon nitride ceramics was evaluated with specific grinding energy and strength degradation. The main results are summarized as below. (1) The wheel with homogeneously controlled distribution of grain cutting edge showed lower specific grinding energy, and demonstrated higher fracture strength of the ground workpiece at the same value of stock removal rate. (2) The wheel with homogeneously controlled distribution of grain cutting edge demonstrated small strength degradation and distribution of fracture strength of the ground work-piece through decrease in the mean value of maximum grain depth of cut.
Journal
-
- Journal of the Ceramic Society of Japan
-
Journal of the Ceramic Society of Japan 103 (1203), 1142-1146, 1995
The Ceramic Society of Japan
- Tweet
Keywords
Details 詳細情報について
-
- CRID
- 1390282680253825792
-
- NII Article ID
- 110002291247
-
- NII Book ID
- AN10040326
-
- ISSN
- 18821022
- 09145400
-
- NDL BIB ID
- 3640558
-
- Data Source
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- Abstract License Flag
- Disallowed
