書誌事項
- タイトル別名
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- Optimization of Lapping Plate/Polishing Cloth Groove Rates in Radius Direction Using Genetic Algorithm for 4-Way Wafer System
- イデンテキ アルゴリズム オ モチイタ 4way ホウシキ ジョウバン ニ オケル ハンケイ ホウコウ ミゾ ワリアイ ノ サイテキカ
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In the lapping/polishing is used frequently for making high precision surface finishes, and the waviness reduction in lapped/polished wafers needs to be improved. It is known that the efficiency depends on the relative friction distance between the lapping plate/polishing cloth and the wafer, and that the wafer waviness depends on the result of the deviation of relative friction distance. This study presents a method for making optimal lapping plate/polishing cloth groove rates in the radius direction for the 4-way wafer system. A genetic algorithm is used for decreasing the deviation of relative friction distance at wafer surface. The maximum deviation of relative friction distance under each calculation conditions is used for optimizing fitting function at the genetic algorithm in this paper. Simulation results show the genetic algorithm can design groove rates in a lapping plate/polishing cloth in which the deviation of relative friction distance to be remarkably small.
収録刊行物
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- 精密工学会誌論文集
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精密工学会誌論文集 70 (5), 651-655, 2004
公益社団法人 精密工学会
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詳細情報 詳細情報について
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- CRID
- 1390282680258085632
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- NII論文ID
- 110001823987
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- NII書誌ID
- AA11966630
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- ISSN
- 18818722
- 13488716
- 13488724
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- NDL書誌ID
- 7076334
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可