Attempt to Stability Improvement on FEA of Tensile Tests, Tension-Compression Tests and Stress Relaxation Tests

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  • HAYASHI Takeharu
    National Institute of Technology, Tokyo College Department of Mechanical Engineering
  • EBIHARA Yoshinori
    Tokyo Gakugei University, Department of Education
  • WATANABE Hirohiko
    Fuji Electric Co., Ltd., Production Technology Department Section, Equipment Technology Department, Production Engineering Center
  • ASAI Tatsuhiko
    Fuji Electric Co., Ltd., Materials Engineering Research Dept., Fundamental Technology Research Center, Advanced Technology Laboratory

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Other Title
  • 鉛フリーはんだの引張試験、引張圧縮試験および応力緩和試験の有限要素解析における安定性向上の試み
  • ナマリ フリーハンダ ノ ヒッパリ シケン 、 ヒッパリ アッシュク シケン オヨビ オウリョク カンワ シケン ノ ユウゲン ヨウソ カイセキ ニ オケル アンテイセイ コウジョウ ノ ココロミ

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Abstract

  In the estimation of the fatigue life of lead-free solder joints under cyclic temperature load, it is important to use FE analysis technology using a constitutive model which can exhibit mechanical properties of the lead-free solder joints. In previous study, we proposed a decoupled viscoplastic-creep constitutive model which can describe stress strain curves, stress strain hysteresis loops and stress relaxation curves, with these temperature dependencies and these rate dependencies. In this study, the algorithm for stress calculation is built by implicitly-time-integration scheme to our proposed model, aiming at improvement of stability. Next, the algorithm was implemented into finite element analysis code ABAQUS via its user material subroutine UMAT. Then, tensile tests, tension-compression tests and stress relaxation tests were analyzed, using this program. It was confirmed that the stability of the analysis was improved.

Journal

  • Journal of Smart Processing

    Journal of Smart Processing 4 (4), 207-214, 2015-07-20

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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