書誌事項
- タイトル別名
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- Bonding Strength Evaluation for Hermetic Seal of MEMS Package
- MEMS パッケージ フウシ セツゴウブ ノ キョウド シンライセイ ヒョウカ
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抄録
In order to secure the certain operation of MEMS devices, it is very important to design a hermetically sealed package which protects the device from wet environments, taking into account the reliability of cap bonding of MEMS packages. Anodic bonding is a popular cap bonding method. In this process, glass and single crystal silicon are bonded at high temperature under high voltage conditions. In this study, the new production method of device size specimen with an interface crack by wafer process is proposed. And an attempt is made to establish a method of testing the cap bonding strength of packages and to make clear the interface strength of anodic bonding between the glass and single crystal silicon.
収録刊行物
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- 材料
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材料 56 (10), 926-931, 2007
公益社団法人 日本材料学会
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詳細情報 詳細情報について
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- CRID
- 1390282680395831424
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- NII論文ID
- 130002085985
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- NII書誌ID
- AN00096175
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- ISSN
- 18807488
- 05145163
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- NDL書誌ID
- 8976763
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可