書誌事項
- タイトル別名
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- Effect of Micro Texture of Electroplated Copper Thin Films on Their Mechanical Properties
- ドウ メッキ ハクマク キカイ トクセイ ノ ビサイ ソシキ イソンセイ
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The mechanical properties of copper thin films formed by electroplating were compared with cold-rolled copper films using tensile test and nano-indentation. Both the Young's modulus and tensile strength of the films were found to vary drastically depending on the microstructure of the films. Though the Young's modulus of the cold-rolled film was almost same as that of bulk material, that of the electroplated thin film was about a fourth of that of bulk material. The microstructure of the electroplated film was polycrystalline and a columnar structure with a diameter of a few hundreds-micron and the strength of the grain boundaries of the columnar grains seemed to be rather week. The superplastic deformation was observed in the film due to the cooperative grain boundary sliding. In addition, there was a sharp indentation depth dependence of Young's modulus of the film. There was also a plane distribution of Young's modulus near the surface of the film depending on the distribution of the diameter of the columnar grains.
収録刊行物
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- 材料
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材料 56 (10), 907-912, 2007
公益社団法人 日本材料学会
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詳細情報 詳細情報について
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- CRID
- 1390282680395834240
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- NII論文ID
- 130002085982
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- NII書誌ID
- AN00096175
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- COI
- 1:CAS:528:DC%2BD2sXhtlaqu7zK
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- ISSN
- 18807488
- 05145163
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- NDL書誌ID
- 8976708
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- 抄録ライセンスフラグ
- 使用不可