書誌事項
- タイトル別名
-
- The Use of Electrical Simulator for Measurement of Thermoelastic Plane Surface
- ヘイメン ネツ オウリョク モンダイ ノ デンキテキ ソウジ ソクテイホウ ニ ツイテ
この論文をさがす
説明
It is generally known that the biharmonic equation can be solved upon mutual analogy in the use of resistance simulator, and that the problems concerning the equations for thermoelastic two-dimensional surface in the multiply connected regions will be divided between Laplace's and Poisson's equations.<br>In the present paper it is demonstrated theoretically that the problems concerning the equations of thermoelastic two dimensional surface in the multiply connected regions can be solved upon mutual analogy in the use of resistance simulator, and for its verification the estimation of stress distribution has accordingly been made in the circular ingot mould.<br>The agreement of the measurement made by using resistance simulator with the theoretical values is found to have been sufficiently established for practical purposes. Although there is some difficulty in setting boundary conditions when this method is used, and in spite of the errors that inevitably arise in numerical differentiation of stress function, this method is commendable as being efficient for estimation of thermal stress distributed in the multiply connected regions.
収録刊行物
-
- 材料
-
材料 20 (216), 1031-1037, 1971
公益社団法人 日本材料学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390282680396420224
-
- NII論文ID
- 110002300056
-
- NII書誌ID
- AN00096175
-
- ISSN
- 18807488
- 05145163
-
- NDL書誌ID
- 8220250
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可