X-Ray Stress Measurement for Textured Materials

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  • X-Ray Stress Measurement for Textured M

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Abstract

Various stresses were applied to specimens prepared from silicon carbide and cold-rolled stainless steel, JIS type SUS 304, and the changes in peak positions of a diffraction line on a sin2ψ diagram were investigated for x-ray diffraction measurement of residual stress of textured materials. Seven peak positions of a diffraction line measured at different ψ angles for each applied stress oscillated in a sin2ψ diagram. However, the slope M and the intercept N of a straight line fitted to the seven peak positions varied linearly with the applied stress σ0. It is confirmed analytically and experimentally that these experimental findings show that the lattice strain for a fixed ψ angle varies linearly with applied stress as is the case with isotropic materials. Therefore, the stress constant K of textured materials can be determined experimentally as the reciprocal of the slope of the straight line in the M-σ0 diagram.

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