<b>Development of Thermosetting Resins for Electronic Materials </b>

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  • <b>電子材料向け熱硬化性樹脂の開発動向 </b>
  • 電子材料向け熱硬化性樹脂の開発動向
  • デンシ ザイリョウ ムケ ネツ コウカセイ ジュシ ノ カイハツ ドウコウ

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<p>In recent years, as electronic devices become higher in performance, higher performance is required for components. Various characteristics are required for the resin used for electronic materials. For example, high heat resistance for lead-free soldering process, flame retardance for environmental regulation, low dielectric properties for high speed transmission, low thermal expansion coefficient for reliability during mounting, low water absorption rate, and so on. Various resins have been developed to meet these requirements. This review introduces development of resin with high heat resistance, low dielectric property and flame retardance.</p>

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