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<b>The Relationship between Higher Order Structure and Thermal Conductivity of Mesogen-containing Epoxy Composite </b>
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- YOSHIDA Yuka
- Tsukuba Research Laboratory, Hitachi Chemical Co.,Ltd.
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- YAGI Yasuhiro
- Tsukuba Research Laboratory, Hitachi Chemical Co.,Ltd.
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- TANAKA Shingo
- Hitachi Research Laboratory, Hitachi Ltd.
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- TAKEZAWA Yoshitaka
- Tsukuba Research Laboratory, Hitachi Chemical Co.,Ltd.
Bibliographic Information
- Other Title
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- <b>メソゲン含有エポキシ樹脂のコンポジット状態での </b><b>高次構造と熱伝導率の関係 </b>
- メソゲン含有エポキシ樹脂のコンポジット状態での高次構造と熱伝導率の関係
- メソゲン ガンユウ エポキシ ジュシ ノ コンポジット ジョウタイ デ ノ コウジ コウゾウ ト ネツ デンドウリツ ノ カンケイ
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Description
The improvement in the thermal conductivity of the matrix resin is effective to improve the thermal conductivity of the composite. The developed mesogenic epoxy resin forms self-arranged domain when cured, which contributes to the high thermal conductivity. But, the higher order structure in the mesogen-containing epoxy composite has not been confirmed. So, we observed the structure directly using X-ray diffraction, and clarified the relationship between higher order structure and thermal conductivity of the mesogen-containing epoxy composite. We also confirmed diffraction peak of the smectic structure of resin by X-ray diffraction. Thus, the higher order structure formed in the filler-rich composite of mesogenic epoxy resin was clarified to contribute to the high thermal conductivity of the composite. In addition, it was clarified that the liquid crystalline ordering of the mesogenic epoxy resin was further enhanced by fillers.
Journal
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- Journal of Network Polymer,Japan
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Journal of Network Polymer,Japan 35 (2), 70-75, 2014
Japan Thermosetting Plastics Industry Association
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Details 詳細情報について
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- CRID
- 1390282680436438400
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- NII Article ID
- 130004728030
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- NII Book ID
- AN10521608
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- ISSN
- 2186537X
- 13420577
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- NDL BIB ID
- 025374946
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- CiNii Articles
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- Abstract License Flag
- Disallowed