<b>Plating of Hybrid Film Formed by Photoirradiation: </b><b>Fabrication of A Metallic Pattern by Direct Electroless Copper Deposition </b><b>on A Photolithographic Pattern </b>

DOI Web Site 1 Citations

Bibliographic Information

Other Title
  • <b>紫外光照射によるめっき可能なハイブリッド薄膜の作製：</b><b>光リソグラフィーと無電解銅めっきによる金属パターン形成 </b>
  • 紫外光照射によるめっき可能なハイブリッド薄膜の作製 : 光リソグラフィーと無電解銅めっきによる金属パターン形成
  • シガイコウ ショウシャ ニ ヨル メッキ カノウ ナ ハイブリッド ハクマク ノ サクセイ : ヒカリ リソグラフィー ト ムデンカイ ドウメッキ ニ ヨル キンゾク パターン ケイセイ

Search this article

Abstract

Printed circuits on a fl exible fi lm are important components for fl exible electronics. Electroless metal deposition is a simple and cost-effective method to fabricate metallic patterns on a fl exible fi lm. We review the formation of a palladiumnanoparticle/silica-nanoparticle/acrylic-polymer hybrid negative pattern on a flexible film by photolithography and its conversion to a copper pattern by electroless plating. The negative pattern of the hybrid was formed by UV-irradiation of the resist film, which contained acrylate monomer, palladium salt, and a photo-radical initiator. The photochemically generated radicals induced the radical polymerization of the acrylate and also reduced the palladium ion to form palladium nanoparticles. A copper film was deposited on the surface of the hybrid pattern by electroless plating. On the surface of the hybrid, the palladium-nanoparticles work as a catalyst, and the nanometer-scale roughness caused with the silica nanoparticles, increases the adhesion between the polymer and copper.

Journal

Citations (1)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top