Internal Stress of Epoxide Resin Coating in the Presence of Reactive Diluent

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  • 反応性希釈剤の存在下におけるエポキシ樹脂コーティングの内部応力
  • ハンノウセイ キシャクザイ ノ ソンザイカ ニ オケル エポキシ ジュシ コー

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The internal stress of bisphenol-type epoxide resin coating cured with 4, 4′-diaminodiphenylmethane in the presence of phenylglycidylether as a reactive diluent was investigated by measuring the changes of shrinkage and internal stress in the curing and the cooling processes.<BR>The internal stress was caused by the shrinkage occurred in the cooling process from the glasstransition temperature to room temperature. The internal stress increased with increasing linear shrinkage of the cured systems, with an elevation of glass-transition temperature, and with decreasing concentration of the reactive diluent.<BR>From the above observations, it was suggested that the decrease in glass-transition temperature and the increase in concentration of reactive diluent were necessary to reduce the internal stress caused by curing.

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