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Phosphorus distribution in the electroplating and electroless NiP deposits
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- Tashiro Katsuhiko
- Kanto-Gakuin University graduate school
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- Nakazato Junichi
- Department of Engineering Kanto-Gakuin University
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- Yamamoto Seiji
- Kanto-Gakuin University graduate school
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- Honma Hideo
- Department of Engineering Kanto-Gakuin University
Bibliographic Information
- Other Title
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- 無電解および電析NiPめっき膜中のリンの分布状態
Description
This paper describes the phosphorus distribution and content in the electroplating and electroless nickel films at both the initial stages and following steady state of deposition conditions. From the results of EPMA, GDOES, AES and ESCA measurements, it was found that phosphorus contents in the deposited films at the initial stages indicate higher values than the following steady state deposition. The highest phosphorus content in the films was obtained from the citric acid bath among the tested complexing agents. The P rich layer around 20 to 40 nm in thickness calculating by the AES sputtering rate is produced at the initial stages of deposition and this layer is always staid at the surface of the deposited film along with the advancement of deposition reaction.
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 17 (0), 9-9, 2002
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282680530551424
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- NII Article ID
- 130006954797
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed