The Application Plating on Photoresist for MEMS Micro Structure

DOI

Bibliographic Information

Other Title
  • MEMS構造に対応した感光性樹脂上へのめっきの応用

Abstract

Recently, miniaturization and complexing of electronic components advanced. In the case of micro structure producing (MEMS), some methods were a sputtering process. However, sputtering process is so expensive that fusion of photolithograph technique and wet plating method are focused to the method of manufacturing micro structure components. Therefore, new alternative method of sputtering process is investigated and this method was achieved that formation of conductive layer on all over substrates by electroless plating and produce of micro structure was tried by this process.

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Keywords

Details 詳細情報について

  • CRID
    1390282680532031744
  • NII Article ID
    130005469393
  • DOI
    10.11486/ejisso.23.0_200
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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