The Application Plating on Photoresist for MEMS Micro Structure
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- Baba Kunihito
- Kanto Gakuin Univ.
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- Nakamaru Yaichirou
- Kanto Gakuin Univ.
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- Misumi Koichi
- Tokyo Ohka Kogyo co., ltd.
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- Honma Hideo
- Kanto Gakuin Univ.
Bibliographic Information
- Other Title
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- MEMS構造に対応した感光性樹脂上へのめっきの応用
Abstract
Recently, miniaturization and complexing of electronic components advanced. In the case of micro structure producing (MEMS), some methods were a sputtering process. However, sputtering process is so expensive that fusion of photolithograph technique and wet plating method are focused to the method of manufacturing micro structure components. Therefore, new alternative method of sputtering process is investigated and this method was achieved that formation of conductive layer on all over substrates by electroless plating and produce of micro structure was tried by this process.
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 23 (0), 200-201, 2009
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282680532031744
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- NII Article ID
- 130005469393
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed