Structural Analysis in Bending Distance of PWB at reflow profile

DOI

Bibliographic Information

Other Title
  • リフロー時におけるプリント基板の反り解析

Description

As for the PWB of a portable product,it tends to become high density wiring and thinly. The warp of the PWB and PKG causes to unjoint and the bridge of the solder joint in the reflow process. This time, authors design the simple evaluation substrate, and shadow moire technique measurement and the numerical simulation for the temperature profile of the reflow are executed. Temperature dependent material properties are measured,and They are used for the simulation.Then,Authors reports the correlation of the simulation result and the measured value.The warp forecast of the substrate by the simulation become possible.

Journal

Keywords

Details 詳細情報について

  • CRID
    1390282680532801664
  • NII Article ID
    130004588873
  • DOI
    10.11486/ejisso.19.0.37.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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