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Preparation of Copper Electric Circuits by Inkjet Printing on Polyimide Films
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- Sakai Yuichi
- TITC
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- Futakuchi Tomoaki
- TITC
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- Shinohara Orie
- Tateyama Kagaku Industry Co.
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- Ueda Youji
- Tateyama Kagaku Industry Co.
Bibliographic Information
- Other Title
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- インクジェット法を利用したポリイミド上への銅めっきパターンの作製
Description
The inkjet technology is an environment-friendly technology in terms of resources and energy savings. Applied studies of inkjet technology for the industrial fabrication of electric devices have been advanced. In those studies, fabrications of electric circuits using inkjet ink contained nano-sized metal have been mainly reported. In this study, preparation of copper circuits by using ink contained activator for electroless copper plating on polyimide films was investigated, and electric properties of plated copper patterns were examined.
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 21 (0), 105-107, 2007
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282680533298176
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- NII Article ID
- 130005010763
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed