Study on Oscillation Controlled Lapping Method using Small Diameter Lap Tool

DOI

Bibliographic Information

Other Title
  • 小径工具を用いた揺動制御ラッピングの研究
  • Slurry Flow Mechanism and Controlled Characteristics
  • スラリーフローの解明と形状制御特性に関する検討

Abstract

This study aims to develop and propose an oscillation controlled lapping method, which uses a small diameter lap tool and is classed in the single wafer lapping system, as a effective method to achieve high precision controlled lapping of large size silicon wafer. Our previously paper shows the fundamental controlled lapping characteristics under both the theoretical and the experimental examinations. On the other hand, the lapping characteristics are affected by the slurry flow. Therefore, this paper describes the relation between the slurry flow and the lapping characteristics of the proposed method based on a series of lapping and observing experiment.

Journal

Keywords

Details 詳細情報について

  • CRID
    1390282680628547456
  • NII Article ID
    130005029590
  • DOI
    10.11522/pscjspe.2009s.0.299.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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