Investigation on Polishing Temperature of Magnetic Disk Substrate

DOI

Bibliographic Information

Other Title
  • 磁気ディスク基板のポリシング温度の検討

Abstract

In the previous research, polishing conditions of high pressure and high speed are found useful for the high removal rate polishing with ultra-smoothness polishing. The high removal rate polishing, however, causes the high temperature rise of polisher surface due to large quantity of heat generation. The high temperature rise damages the surface of polisher. To repress the temperature rise, in this research, the effect of water-flowing inside polishing plate on the repression of temperature rise is examined firstly and its method is ascertained useful. Under using the method, on the basis of the results, the relationship between the temperature rise and polishing conditions is investigated.

Journal

Keywords

Details 詳細情報について

  • CRID
    1390282680629302144
  • NII Article ID
    130004658053
  • DOI
    10.11522/pscjspe.2006a.0.255.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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