Singulation Characteristics of Semiconductor Package Using Pulsed Fiber Laser and SHG:YAG Laser
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- Okamoto Yasuhiro
- Okayama University
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- Kitada Ryoji
- Okayama University
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- Okada Akira
- Okayama University
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- Uno Yoshiyuki
- Chugoku Polytechnic College
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A laser singulation method by the superposition of a pulsed fiber laser and an SHG:YAG laser (SHG: Second Harmonic Generation) was proposed to perform the high-quality processing of semiconductor packages, which are consisted of thermosetting epoxy-resin with silica as the molding compounds and a glass epoxy board with insulator coatings for the semiconductor package. The superposition of the pulsed fiber laser and SHG:YAG laser with a high pulse repetition rate led to a straighter kerf shape with a smaller kerf width under the same pulse energy condition. A smaller kerf width was achieved by controlling the time-delay between the laser pulses compared with synchronized laser pulses. The heat affected zone from the cut surface was reduced by the superposition of the pulsed fiber laser and SHG:YAG laser. Moreover, synchronized laser pulses led to a smaller heat affected zone compared with unsynchronized pulses.
収録刊行物
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- International Journal of Electrical Machining
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International Journal of Electrical Machining 19 (0), 28-33, 2014
一般社団法人 電気加工学会
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詳細情報 詳細情報について
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- CRID
- 1390282680732481024
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- NII論文ID
- 130004709077
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- NII書誌ID
- AN10564586
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- ISSN
- 21885117
- 13417908
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- NDL書誌ID
- 028573074
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可