半導体封止材用添加剤の機能性評価条件の確立

DOI Web Site

書誌事項

タイトル別名
  • Examination of Functionality Evaluation Condition of Additive for IC Package
  • 半導体封止材用添加剤の機能性評価条件の確立[含 Q&A]
  • ハンドウタイ フウシザイヨウ テンカザイ ノ キノウセイ ヒョウカ ジョウケン ノ カクリツ ガン Q A

この論文をさがす

抄録

<p>Test conditions for evaluating the functionality of additives for sealants used for IC packaging were examined. New test conditions were established by use of a simple test piece, focusing on corrosion and increased resistance of wiring in the initial stages of degradation. Conventional test methods required repetitive measurement of 10 to 20 samples and took several hundred hours, but the new test conditions require essentially no repetition and the sealant was evaluated accurately in one tenth of the time required previously. The new conditions were used to develop an additive with high functionality. In an evaluation by a sealant manufacturer, the additive received a top quality rating.</p>

収録刊行物

  • 品質工学

    品質工学 18 (6), 60-65, 2010

    一般社団法人 品質工学会

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ