1318 Laser Soldering of Lead-free Solder : Multi-spot Simultaneous Laser Soldering by Holographic Optical Element and Effect of Preheating

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  • 1318 鉛フリーはんだを用いたレーザソルダリング : ホログラフィック光学素子による多点同時はんだ付けと予熱の効果(GS-13,14 生産加工・生産システム(2),研究発表講演)

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In this study, laser soldering of lead-free solder, which has promoted for environmental protection, was investigated. Laser soldering has been commonly performed by scanning of a laser beam on solder areas. However, it has problems with tomb stoning and jointed chip components with a lean. Here we propose the multi-spot simultaneous laser soldering by use of Holographic Optical Element (HOE). For that purpose, the HOE was designed and fabricated. And samples which were soldered two-spot simultaneously were compared with samples which were soldered in the scanning method. Additionally, the solder joints of Sn-Ag-Cu solder were equal to eutectic Sn-Pb solder. But the solder joints of Sn-Zn-Bi solder were low in comparison with the one of Sn-Pb and Sn-Ag-Cu because of poor wettability. Hence, we investigated about the improvement of wettability by preheating. The mechanical reliability of soldering was evaluated by joint strength test.

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