Measurement of the Strength of Bicrystal Sample Cut From Polycrystalline Copper Thin Film
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- Luo Yifan
- Department of Finemechanics, Graduate School of Engineering, Tohoku University
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- Suzuki Ken
- Tohoku University
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- Miura Hideo
- Tohoku University
Bibliographic Information
- Other Title
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- 銅二結晶試料の材料強度評価
Abstract
<p>In this study, the tensile strength of a bicrystal sample cut from a polycrystalline copper thin film was investigated by applying a micro tensile test system. As the previous researches have showed that the crystallinity of a grain boundary was evaluated quantitatively by using IQ (Image Quality) value obtained from EBSD (Electron Back-Scatter Diffraction) analysis, and plastic deformations started to occur in one grain in the sample when the IQ value was higher than 3500. In this study, the plastic deformation of one grain was observed in detail after the sample was pulled off by using SEM (Scanning electron microscope). Slip bands were observed clearly on the fracture surface.</p>
Journal
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- The Proceedings of Autumn Conference of Tohoku Branch
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The Proceedings of Autumn Conference of Tohoku Branch 2016.52 (0), 507-, 2016
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390282680830188416
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- NII Article ID
- 130007089501
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- ISSN
- 24242721
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed