金属含有多孔質定盤によるサファイア基板の研磨特性の検討

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  • Study on lapping Characteristics of Sapphire Substrate by Metal-Containing Porous Plate

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In recent years, demand for sapphire substrate is expected. Sapphire has various properties and is applied to machinery. The main processing method of the sapphire substrates cutting it, and it is with chamfering, heat-treatment, primary lapping, second lapping, CMP, washing. Of these, Copper and tin platens are used for lapping sapphire substrates by second lapping. However, sapphire is difficult to process, so its processing efficiency is poor. A metal-containing porous surface plate having porosity was newly developed by newly adding metal powder to the resin. Therefore, a lapping experiment of a sapphire substrate is carried out using a copper plate used for processing and a newly developed metal-containing porous plate, and its lapping characteristics are compared and investigated.

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