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- ISOBE Koki
- Dept. of Finemechanics, Graduate School of Engineering, Tohoku University
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- KATO Takeru
- Dept. of Finemechanics, Graduate School of Engineering, Tohoku University
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- SUZUKI Ken
- Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
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- MIURA Hideo
- Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
Bibliographic Information
- Other Title
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- Siひずみゲージ応用衝撃力センサの試作
Abstract
<p>A strain sensor which can monitor the change of local stress distribution in 3-D stacked structures was developed by applying the piezoresistive effect of single-crystalline silicon. The sensor was embedded in a silicon chip, and it measured the impact effect for the chip during the manufacturing and operating process of electronic products. The strain dependence of the electrical conductivity of the sensor was evaluated. Fabricated sensor showed liner voltage-current characteristics and the gauge factor of about 100.</p>
Journal
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- The Proceedings of the Materials and Mechanics Conference
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The Proceedings of the Materials and Mechanics Conference 2016 (0), PS-06-, 2016
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390282680849189376
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- NII Article ID
- 130007121904
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- ISSN
- 24242845
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed