書誌事項
- タイトル別名
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- 508 Development of Ultraprecision Alignment Device with High Load Capacity Driven by Means of Walking Drive
抄録
This paper presents a new ultraprecision alignment device with high load capacity, which is targeted for ultraprecision bonding in a vacuum. The ultraprecision bonding is recently needed for emerging production technologies such as nanoimprint, MEMS and WOW. The device is driven by 'Walking Drive', which is an unique driving method to realize ultraprecision positioning with long stroke by utilizing piezoelectric actuators. The method is suitable for high load capacity and the ultraprecision positioning in a vacuum. Mechanical parts of the device are designed by utilizing FEM analysis, so that the device has a high load capacity of greater than 1 ton. It is confirmed experimentally that the developed alignment system has the high load capacity and also fine positioning resolution of less than 10nm.
収録刊行物
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- 生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
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生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会 2006.6 (0), 79-80, 2006
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390282680877254912
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- NII論文ID
- 110006638907
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- ISSN
- 24243094
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可