Electrodeposition Behavior of Dendritic Copper from Aqueous Copper (I) Chloride Solution Containing Condensed Sodium Halides

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  • MURASE Kuniaki
    Department of Materials Science and Engineering, Kyoto University
  • TAMAGAWA Kohei
    Department of Materials Science and Engineering, Kyoto University
  • MIZOTA Nao
    Department of Materials Science and Engineering, Kyoto University
  • MOTOBA Kazuhiko
    Technology Development Center, Nippon Mining & Metals Co., Ltd.
  • ABE Yoshifumi
    Technology Development Center, Nippon Mining & Metals Co., Ltd.
  • AWAKURA Yasuhiro
    Department of Materials Science and Engineering, Kyoto University

Bibliographic Information

Other Title
  • 塩化銅（Ｉ）を含むハロゲン化ナトリウム濃厚水溶液からの銅デンドライトの電析挙動
  • エンカ ドウ I オ フクム ハロゲンカ ナトリウム ノウコウ スイヨウエキ カラ ノ ドウ デンドライト ノ デンセキキョドウ

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Description

Potentiostatic electrodeposition behavior of dendritic copper from acidic copper(I) chloride (cuprous chloride) bath containing sodium chloride and sodium bromide was investigated. The morphology, or appearance, of copper dendrite and sodium content in the dendrite as an impurity were both influenced by deposition potential (0 to -150 mV vs. SHE), bath temperature (R.T. to 60°C) or Cu(I)-ion concentration (0.35 to 1.14 mol dm-3) investigated, while current efficiency for the deposition was 99% or more irrespective of the deposition condition investigated. Bath pH did not affect the deposition behavior within pH 0 to 2. Bath temperature was found to be the most important factor influencing the deposition current. The deposition behaviors were discussed with the potential-pH diagram of the Cu-Cl-H2O system.

Journal

  • Shigen-to-Sozai

    Shigen-to-Sozai 121 (4/5), 103-110, 2005

    The Mining and Materials Processing Institute of Japan

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