J0601-3-2 Underfill material dependence of the local residual stress of fli-chip on area-arrayed fine bump

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  • J0601-3-2 エリアアレイ型フリップチップ実装局所残留応力のアンダーフィル材質依存性([J0601-3]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

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Local large residual stress and the local deformation appears clearly in thinned flip chip structures because of the difference in material properties such as Young's modulus and the coefficient of thermal expansion among a bump, underfill, and a silicon chip. Since such large residual stress and the local deformation deteriorate the reliability of electronic devices, the authors measured them by using piezoresistive strain sensor chips. As a result, it was found that the amplitude of the local distribution of the residual stress reached about 100 MPa and the local deformation of about 5 μm remained on the back surface of the mounted chips. The dominant factors of the local residual stress and the deformation were the coefficient of thermal expansion and Young's modulus of underfill and the bump pitch.

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